发明名称 METAL MICRONEEDLE ARRAY, TRANSDERMAL DELIVERY PATCH, AND MICRONEEDLE TRANSDERMAL DELIVERY STAMP
摘要 <p>A metal microneedle array, a transdermal delivery patch with the metal microneedle array, and a microneedle transdermal delivery stamp. The metal microneedle array comprises a substrate (1) and at least one metal sheet (2). The substrate (1) is a solid plate, a solid cylindrical body or a hollow cylindrical body, and has an operation surface in a plane or curved surface shape. The metal sheet (2) is fixed on the substrate (1). Multiple integral microneedles (3) spaced to each other are formed on at least one edge of the metal sheet (2). Each microneedle (3) has a free end and a fixed end connected to the metal sheet (2). A structure of the free end of the microneedle (3) is a needle point (4). The metal sheet (2) is embedded in the operation surface, and at least one part of the microneedle (3) protrudes over the operation surface to form a preset angle with the operation surface. The microneedles (3) in the microneedle array have good consistency, and the manufacturing process of the microneedle array is simplified, and flexibility of the structure design and application is good.</p>
申请公布号 WO2014187338(A1) 申请公布日期 2014.11.27
申请号 WO2014CN78116 申请日期 2014.05.22
申请人 TSINGHUA UNIVERSITY 发明人 YUE, RUIFENG;WANG, YAN
分类号 A61M37/00 主分类号 A61M37/00
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