FILM FOR SEMICONDUCTOR DEVICE MANUFACTURING, MANUFACTURING METHOD OF FILM FOR SEMICONDUCTOR DEVICE MANUFACTURING, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To favorably detach a dicing tape with an adhesive layer from a separator.SOLUTION: In a semiconductor device manufacturing method using a film for semiconductor device manufacturing, the film for semiconductor device manufacturing is characterized that: (a) a dicing tape with an adhesive layer in which an adhesive layer is laminated on a dicing tape is laminated on a separator at a predetermined distance from the separator by application of the adhesive layer as a bonding surface; (b) the separator has a slit along an outer periphery of the dicing tape; (c) a depth of the slit is not more than 2/3 of a thickness of the separator; and (d) the adhesive layer is added with a coloring agent and attached to a rear face of a semiconductor chip included in a flip-chip mounted semiconductor device. The semiconductor device manufacturing method comprises a process of detaching a separator from a film for semiconductor device manufacturing and a process of attaching a semiconductor wafer to an adhesive layer.