| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder paste that is excellent in wet ability and has stress relaxation property capable of standing actual use, and can stand reflow temperature which is about 300°C sufficiently.SOLUTION: Provided is the solder paste containing a Zn-based solder alloy and a flux. The Zn-based solder alloy comprises 1.0 mass%-9.0 mass% of Al, at least one of Mg and Ge, when containing Mg, 0.1 mass%-4.0 mass%, when containing Ge, 0.05 mass%-6.0 mass%, and balance is formed of Zn except for chemical elements inevitably contained in production, in which a total amount of the Zn-base solder alloy is 100 mass%. |
