发明名称 AEROGEL-BASED MOLD FOR MEMS FABRICATION AND FORMATION THEREOF
摘要 The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.
申请公布号 US2014349078(A1) 申请公布日期 2014.11.27
申请号 US201414455745 申请日期 2014.08.08
申请人 Honeywell International Inc. 发明人 Carlson Robert Jon
分类号 B29C33/38;B81B7/00;B29C41/00;B29C59/16;B29C59/14 主分类号 B29C33/38
代理机构 代理人
主权项 1. A method of fabricating a microelectromechanical structure, the method comprising: providing a substrate having an aerogel-based layer over a portion of the substrate; writing a structural feature in the aerogel-based layer, the structural feature having a surface contour that is substantially the same as a surface contour of at least a part of a microelectromechanical feature; and depositing a dense material layer over the aerogel-based layer to form at least part of the microelectromechanical feature, wherein a portion of the dense material layer is directly attached to another portion of the substrate.
地址 Morristown NJ US