发明名称 THERMALLY CONDUCTIVE SHEET AND PROCESS FOR PRODUCING SAME
摘要 A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.
申请公布号 US2014349067(A1) 申请公布日期 2014.11.27
申请号 US201414323423 申请日期 2014.07.03
申请人 DEXERIALS CORPORATION 发明人 USUI Hiroyuki;ARAMAKI Keisuke
分类号 C08K7/18;C08L83/04;B29C47/00;C08K7/06 主分类号 C08K7/18
代理机构 代理人
主权项 1. A thermally conductive sheet produced by the following steps: extruding a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler and another filler through an extruder, thereby extrusion molding an extrusion molded product in which the anisotropic thermally conductive filler is oriented along the extrusion direction; curing the extrusion molded product to form a cured object; and cutting the cured object in a direction perpendicular to the extrusion direction into a given thickness with an ultrasonic cutter, wherein the anisotropic thermally conductive filler is prepared as carbon fibers and has an average fiber length of 100 μm or more, and the other filler is prepared as spherical alumina particles and has an average particle size in a range from 1 μm to 40 μm.
地址 Tokyo JP