| 发明名称 |
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE |
| 摘要 |
An electronic device includes first to third terminals and a clip. The clip includes first to third joint portions and a connection portion. The first to third joint portions correspond to and are bonded to the first to third terminals, respectively. The connection portion connects the first to third joint portions. One terminal in the first to third terminals has a depressed portion depressed to one side in a predetermined direction to store a conductive bonding material. A variation in positions of the first to third terminals in the predetermined direction is absorbed by deformation of the conductive bonding material when one joint portion in the first to third joint portions corresponding to the one terminal is bonded to the one terminal through the conductive bonding material. |
| 申请公布号 |
US2014347838(A1) |
申请公布日期 |
2014.11.27 |
| 申请号 |
US201414283446 |
申请日期 |
2014.05.21 |
| 申请人 |
DENSO CORPORATION |
发明人 |
NAGAYA Toshihiro;OKADA Nobuhiko;HAYASHI Hiromasa |
| 分类号 |
H01L23/495;H01L21/48 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device comprising:
first to third terminals; and a clip including first to third joint portions and a connection portion, the first to third joint portions corresponding to and bonded to the first to third terminals, respectively, the connection portion connecting the first to third joint portions, wherein one terminal in the first to third terminals has a depressed portion depressed to one side in a predetermined direction to store a conductive bonding material, and a variation in positions of the first to third terminals in the predetermined direction is absorbed by deformation of the conductive bonding material when one joint portion in the first to third joint portions corresponding to the one terminal is bonded to the one terminal through the conductive bonding material. |
| 地址 |
Kariya-city JP |
