COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMBEDDED SUBSTRATE MANFACTURED USING THE SAME

摘要

The method includes positioning an electronic component using main marks formed on a metal layer and mounting the electronic component on a second surface of the metal layer with an adhesive layer interposed between the metal layer and both of the electronic component and terminals; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and forming a first window for exposing the main marks therefrom and a second window for exposing the adhesive layer including a position corresponding to the terminal therefrom; then using the exposed main marks as references and forming a laser via hole LVH reaching the terminal in the adhesive layer exposed from the second window; and thereby forming a wiring pattern from the metal layer electrically connected to the terminal through a first conductive via formed by plating the LVH with copper.

主权项

1. A component-embedded substrate manufacturing method of manufacturing a component-embedded substrate where in an insulating substrate having a wiring pattern on a surface thereof, an electrical or electronic component having a terminal electrically connected to the wiring pattern is embedded, the method comprising:
a mark forming step of forming a metal layer to serve as the wiring pattern on a support plate and forming a main mark made of a metal columnar body on a second surface opposite to a first surface contacting the support plate of the metal layer; a component mounting step of positioning the component using the main mark as a reference relative to the metal layer and mounting the component on the second surface of the metal layer with an insulating adhesive layer interposed between the second surface and each of the component and the terminal; a buried layer forming step of forming a buried layer serving as the insulating substrate having the component and the main mark buried on the second surface of the metal layer having the component mounted thereon; a window forming step of separating the support plate from the metal layer, then removing part of the metal layer from the first surface side of the metal layer exposed by the separation, and thereby forming a first window for exposing the main mark and at least a part of the buried layer; a via hole forming step of determining a position of a terminal of the component using the main mark exposed from the first window as a reference and forming a first via hole reaching the terminal; a conductive via forming step of subjecting the first via hole to a plating process, then filling metal thereinto, and thereby forming a first conductive via; and a pattern forming step of forming the wiring pattern from the metal layer electrically connected to the terminal through the conductive via.