| 摘要 |
This wafer holding apparatus for holding a wafer is provided with a wafer holder having the wafer placed thereon, and a lift pin that is provided such that the lift pin can be lifted in the normal line direction of a wafer placing surface with respect to the wafer holder. The lift pin has a leading end portion, and the leading end portion has a bottom portion that forms a suction region for sucking the rear surface of the wafer, and a protruding portion for supporting the rear surface of the wafer within the suction region. At the time of placing the substrate at a target position, local planarity deterioration of the substrate can be suppressed even if the substrate is large. |
