发明名称 AEROSOL DEPOSITION COATING FOR SEMICONDUCTOR CHAMBER COMPONENTS
摘要 A method for coating a component for use in a semiconductor chamber for plasma etching includes providing the component and loading the component in a deposition chamber. A pressure in the deposition chamber is reduced to below atmospheric pressure. A coating is deposited on the component by spraying an aerosol comprising a suspension of a first type of metal oxide nanoparticle and a second type of metal oxide nanoparticle onto the component at approximately room temperature.
申请公布号 WO2014190211(A1) 申请公布日期 2014.11.27
申请号 WO2014US39244 申请日期 2014.05.22
申请人 APPLIED MATERIALS, INC. 发明人 SUN, JENNIFER Y.;KANUNGO, BIRAJA P.;CHO, TOM;ZHANG, YING
分类号 H01L21/208;H01L21/02 主分类号 H01L21/208
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