| 摘要 |
A method for temporary connection of a product substrate to a carrier substrate comprised of the steps of: applying an interconnect layer to a product substrate receiving side of the carrier substrate in an interconnect surface section of the product substrate receiving side, applying an antiadhesion layer with low adhesion force to one interconnect side of the product substrate in an antiadhesion surface section of the interconnect side, the antiadhesion surface section corresponding to the interconnect surface section, in terms of area, wherein a receiving space is formed which is bordered by the interconnect layer and the carrier substrate as well as the product substrate and the antiadhesion layer accommodating structures which are provided on the interconnect side of the product substrate and which project from the interconnect side, aligning the product substrate relative to the carrier substrate and bonding of the interconnect layer to the antiadhesion layer on one contact surface. |
