发明名称 POLISHING HEAD AND POLISHING DEVICE
摘要 <p>The present invention provides a polishing head including: an annular rigid ring; an elastic film bonded to the rigid ring; and an upward and downward movable mid-plate, the mid-plate defining a first sealed space together with the rigid ring and the elastic film; an incompressible fluid enclosed in a sealed space; and a mid-plate positioning device for adjusting vertical position of the mid-plate, to hold a back surface of a workpiece on a lower surface of the elastic film and polish a front surface by bringing the front surface into contact with a polishing pad attached to a turn table, wherein the mid-plate can adjust a shape of the lower surface of the elastic film by adjusting the vertical position of the mid-plate. The polishing head polishes a workpiece without generating surface defects on the workpiece surface and easy detachment of the workpiece from a polishing pad after polishing.</p>
申请公布号 SG11201404306S(A) 申请公布日期 2014.11.27
申请号 SG11201404306S 申请日期 2013.01.28
申请人 SHIN-ETSU HANDOTAI CO.,LTD. 发明人 MASUMURA, HISASHI
分类号 B24B37/30;H01L21/304 主分类号 B24B37/30
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