SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces convex parts on a transparent resin surface of the semiconductor device sealed with the transparent resin, and a method for reducing convex parts on the surface.SOLUTION: A method for manufacturing a semiconductor device formed by sealing a semiconductor chip 1 connected to an electrode on a substrate 5 via a wire 3 with a transparent resin 7, comprises: a first step for mounting the semiconductor chip on the substrate and connecting the semiconductor chip and the electrode on the substrate; a second step for potting the transparent resin to a height for covering the wire on an upper surface of the substrate; a third step for heating and curing the transparent resin obtained by potting it in the second step; and a fourth step for pressing the surface of the transparent resin cured in the third step to soften the resin and planarize the resin surface.