发明名称 AEROSOL DEPOSITION COATING FOR SEMICONDUCTOR CHAMBER COMPONENTS
摘要 A method for coating a component for use in a semiconductor chamber for plasma etching includes providing the component and loading the component in a deposition chamber. A pressure in the deposition chamber is reduced to below atmospheric pressure. A coating is deposited on the component by spraying an aerosol comprising a suspension of a first type of metal oxide nanoparticle and a second type of metal oxide nanoparticle onto the component at approximately room temperature.
申请公布号 US2014349073(A1) 申请公布日期 2014.11.27
申请号 US201414282824 申请日期 2014.05.20
申请人 Applied Materials, Inc. 发明人 Sun Jennifer Y.;Kanungo Biraja;Cho Tom;Zhang Ying
分类号 H01J37/32 主分类号 H01J37/32
代理机构 代理人
主权项 1. A method comprising: providing a component for use in a semiconductor manufacturing chamber; loading the component into a deposition chamber; reducing a pressure of the deposition chamber below atmospheric pressure; and depositing a coating on the component by spraying an aerosol comprising a suspension of a first type of metal oxide nanoparticle and a second type of metal oxide nanoparticle onto the component at approximately room temperature.
地址 Santa Clara CA US