发明名称 |
AEROSOL DEPOSITION COATING FOR SEMICONDUCTOR CHAMBER COMPONENTS |
摘要 |
A method for coating a component for use in a semiconductor chamber for plasma etching includes providing the component and loading the component in a deposition chamber. A pressure in the deposition chamber is reduced to below atmospheric pressure. A coating is deposited on the component by spraying an aerosol comprising a suspension of a first type of metal oxide nanoparticle and a second type of metal oxide nanoparticle onto the component at approximately room temperature. |
申请公布号 |
US2014349073(A1) |
申请公布日期 |
2014.11.27 |
申请号 |
US201414282824 |
申请日期 |
2014.05.20 |
申请人 |
Applied Materials, Inc. |
发明人 |
Sun Jennifer Y.;Kanungo Biraja;Cho Tom;Zhang Ying |
分类号 |
H01J37/32 |
主分类号 |
H01J37/32 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method comprising:
providing a component for use in a semiconductor manufacturing chamber; loading the component into a deposition chamber; reducing a pressure of the deposition chamber below atmospheric pressure; and depositing a coating on the component by spraying an aerosol comprising a suspension of a first type of metal oxide nanoparticle and a second type of metal oxide nanoparticle onto the component at approximately room temperature. |
地址 |
Santa Clara CA US |