Integrated Circuit Structure Having Dies with Connectors

摘要

An embodiment is an integrated circuit structure including a first die attached to a second die by a first connector. The first connector includes a solder joint portion between a first nickel-containing layer and a second nickel-containing layer, a first copper-containing layer between the first nickel-containing layer and the solder joint portion, and a second copper-containing layer between the second nickel-containing layer and the solder joint portion.

主权项

1. An integrated circuit structure comprising a first die having a first bump structure, wherein the first bump structure comprises:
a first metal pillar comprising copper; a first metal cap layer on the first metal pillar, the first metal cap layer comprising a material selected from the group consisting of nickel, tin, tin-lead (SnPb), gold (Au), silver, palladium (Pd), indium (In), nickel-palladium-gold (NiPdAu), nickel-gold (NiAu), combinations thereof, and alloys thereof; a first metal insertion layer comprising copper on the first metal cap layer; and a first solder layer on the first metal insertion layer.