发明名称 |
VARIABLE TEMPERATURE SOLDERS FOR MULTI-CHIP MODULE PACKAGING AND REPACKAGING |
摘要 |
Various methods of mounting semiconductor chips on a substrate are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a first plurality of solder interconnect structures to a first semiconductor chip. The first solder interconnect structures have a first melting point. The first semiconductor chip may be tested. If the first semiconductor chip passes the testing, then a second semiconductor chip is coupled to the first semiconductor chip using a second plurality of solder interconnect structures that have a second melting point lower than the first melting point. |
申请公布号 |
US2014346664(A1) |
申请公布日期 |
2014.11.27 |
申请号 |
US201313899080 |
申请日期 |
2013.05.21 |
申请人 |
Eppes David H. |
发明人 |
Eppes David H. |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing, comprising:
coupling a first plurality of solder interconnect structures to a first semiconductor chip, the first plurality of solder interconnect structures having a first melting point; and coupling a second semiconductor chip to the first semiconductor chip using a second plurality of solder interconnect structures having a second melting point lower than the first melting point. |
地址 |
Driftwood TX US |