| 发明名称 |
CHARGE DAMAGE PROTECTION ON AN INTERPOSER FOR A STACKED DIE ASSEMBLY |
| 摘要 |
An apparatus relating generally to an interposer is disclosed. In such an apparatus, the interposer has a plurality of conductors and a plurality of charge attracting structures. The plurality of charge attracting structures are to protect at least one integrated circuit die to be coupled to the interposer to provide a stacked die. The plurality of conductors include a plurality of through-substrate vias. |
| 申请公布号 |
US2014346651(A1) |
申请公布日期 |
2014.11.27 |
| 申请号 |
US201313899129 |
申请日期 |
2013.05.21 |
| 申请人 |
Xilinx, Inc. |
发明人 |
Xiang Qi;Li Xiao-Yu;Chen Cinti X.;O'Rourke Glenn |
| 分类号 |
H01L23/60;H01L21/82 |
主分类号 |
H01L23/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus, comprising:
an interposer having a plurality of conductors and a plurality of charge attracting structures; wherein the plurality of charge attracting structures are to protect at least one integrated circuit die to be coupled to the interposer to provide a stacked die; and wherein the plurality of conductors include a plurality of through-substrate vias. |
| 地址 |
San Jose CA US |
