| 发明名称 |
HIGH PIN COUNT, SMALL SON/QFN PACKAGES |
| 摘要 |
A plastic SON/QFN package for high power has a pair of oblong metal pins exposed from a surface of the plastic, the pins straddling a corner of the package; each pin has a long axis, the long axes of the pair forming a non-orthogonal angle. |
| 申请公布号 |
US2014345915(A1) |
申请公布日期 |
2014.11.27 |
| 申请号 |
US201414451979 |
申请日期 |
2014.08.05 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
KODURI Sreenivasan K. |
| 分类号 |
H05K1/11;H05K1/02;H01L23/34 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
Dallas TX US |
