发明名称 |
Method and Device of Manufacturing Printed Circuit Board |
摘要 |
Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured. |
申请公布号 |
US2014345913(A1) |
申请公布日期 |
2014.11.27 |
申请号 |
US201214365540 |
申请日期 |
2012.12.12 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
Seo Yeong Uk;Chun Ki Do;Yoo Chang Woo;Seo Hyun Seok;Kim Byeong Ho;Lee Sang Myung |
分类号 |
H05K3/06;H05K1/03;H05K3/00;H05K1/02 |
主分类号 |
H05K3/06 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of manufacturing a printed circuit board, comprising:
preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. |
地址 |
Seoul KR |