LIGHT EMITTING DIODES AND A METHOD OF PACKAGING THE SAME
摘要
Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.
申请公布号
SG11201406646P(A)
申请公布日期
2014.11.27
申请号
SG11201406646P
申请日期
2013.04.19
申请人
RENSSELAER POLYTECHNIC INSTITUTE
发明人
KARLICEK, ROBERT, F.;LU, JAMES, JIAN-QIANG;GOODWIN, CHARLES, SANFORD;TKACHENKO, ANTON