| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a semiconductor device capable of improving the reliability of junction between the wire and the adherend.SOLUTION: A method for manufacturing a semiconductor device having an adherend 20 and a wire W electrically connected to the adherend 20, comprises: a preparation step for preparing the wire W having a projection P formed along an axis of the wire W; and a junction step for jointing the wire W and the adherend 20 by pressing the projection P of the wire W to the adherend 20 using a vibratile bonding tool 12. |
