SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A semiconductor chip is mounted on a first surface of an interconnect substrate, and has a multilayer interconnect layer. A first inductor is formed over the multilayer interconnect layer, and a wiring axis direction thereof is directed in a horizontal direction to the interconnect substrate. A second inductor is formed on the multilayer interconnect layer, and a wiring axis direction thereof is directed in the horizontal direction to the interconnect substrate. The second inductor is opposite to the first inductor. A sealing resin seals at least the first surface of the interconnect substrate and the semiconductor chip. A groove is formed over the whole area of a portion that is positioned between the at least first inductor and the second inductor of a boundary surface of the multilayer interconnect layer and the sealing resin.

主权项

1. A semiconductor device comprising:
a wiring substrate having a first surface and a second surface opposite to the first surface, the second surface having a first area and a second area without the first area, a plurality of electrodes formed on the first surface and a plurality of external electrodes formed on the first area; a first semiconductor chip having a first obverse surface, a first rear surface opposite the first obverse surface, a first long side, a first inductor and a plurality of first electrode pads formed on the first obverse surface, the first electrode pads electrically connected with the electrodes of the wiring substrate via a plurality of first wires, and the first semiconductor chip mounted on the wiring substrate such that the first rear surface being faced to the first surface of the wiring substrate; a second semiconductor chip having a second obverse surface, a second rear surface opposite the second obverse surface, a second long side, a second inductor and a plurality of second electrode pads formed on the second obverse surface, the second electrode pads electrically connected with the electrodes of the wiring substrate via a plurality of second wires, and the second semiconductor chip mounted side by side with the first semiconductor chip on the wiring substrate such that the second rear surface being faced to the first surface of the wiring substrate; and a sealed resin body covering the first surface of the wiring substrate, the first semiconductor chip and the second semiconductor chip, wherein the first long side of the first semiconductor chip is faced to the second long side of the second semiconductor chip, wherein an area between the first long side of the first semiconductor chip and the second long side of the semiconductor chip is arranged within the second area of the wiring substrate in a plan view.