FILM ADHESIVE COMPOSITION, METHOD FOR PRODUCING THE SAME, FILM ADHESIVE, SEMICONDUCTOR PACKAGE USING THE FILM ADHESIVE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE

摘要

A method for producing a composition for film adhesives, said composition having an elastic modulus of 20-3,000 MPa at 200°C after thermal curing and a saturation water absorption of 1.5% by mass or less after thermal curing, and containing (A) an epoxy resin, (B) an epoxy resin curing agent, (C) a phenoxy resin and (D) surface-treated spherical silica fillers which are obtained by surface-treating spherical silica fillers that have an average particle diameter of 0.01-2.0 mum with a silane coupling agent, with the content of the surface-treated spherical silica fillers (D) being 30-70% by mass relative to the total amount of the epoxy resin (A), the epoxy resin curing agent (B), the phenoxy resin (C) and the surface-treated spherical silica fillers (D). This method for producing a composition for film adhesives is characterized by comprising: a step for obtaining a surface-treated spherical silica filler dispersion by dispersing the surface-treated spherical silica fillers (D) in an organic solvent; and a step for obtaining a composition for film adhesives by mixing the epoxy resin (A), the epoxy resin curing agent (B) and the phenoxy resin (C) into the surface-treated spherical silica filler dispersion.