| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin molded article that is excellent in heat resistance and light fastness and is cured by a hydrosilylation reaction.SOLUTION: The resin molded article comprises: a compound ((A) component) having a heterocyclic skeleton or an alicyclic skeleton and having at least two carbon-carbon double bonds reactive with a SiH group in one molecule; a silicon compound ((B) component) containing at least two SiH groups in one molecule; and zinc oxide particles ((C) component) having a number average particle diameter of 0.10 μm or more of primary particles. The (A) component is an organic compound expressed by general formula, vinylcyclohexane, dicyclopentadiene, 1,2,4-trivinylcyclohexane, or vinylnorbornene. In the formula (1), Rto Reach represent an organic group, and at least two of them are alkenyl groups. |
