| 发明名称 |
MOLD SET |
| 摘要 |
A mold set according to embodiment comprising: a die including a plurality of parts and holding a molded material; and a back plate laid below the die. |
| 申请公布号 |
US2014348970(A1) |
申请公布日期 |
2014.11.27 |
| 申请号 |
US201414283958 |
申请日期 |
2014.05.21 |
| 申请人 |
Toshiba Kikai Kabushiki Kaisha |
发明人 |
MATSUZUKI Isao;YAMAMOTO Yoshihiro |
| 分类号 |
B29C33/34 |
主分类号 |
B29C33/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A mold set comprising:
a die including a plurality of parts and holding a molded material; and a back plate laid below the die. |
| 地址 |
Tokyo JP |
