发明名称 積層体、この積層体を用いた導電性基材及びその製造方法
摘要 PROBLEM TO BE SOLVED: To manufacture a conductive base material in which even if calcinated at a low temperature, adhesion is high to also both an organic and inorganic base materials, and which can form a conductive layer with a low resistivity. SOLUTION: In a laminate in which a coating film is formed on a base material via an adhesive layer, the adhesive layer comprises a thermoplastic resin, and the coating film comprises: conductive particles; a binder resin; and a conductive paste containing a dispersion medium. The thermoplastic resin may contain a water borne polyester based resin. The thickness of the adhesive layer may be about 0.1-10μm. The base material may be a substrate which includes: a polyester based resin; a polycarbonate based resin; or a polyimide based resin, or may be a substrate which includes glass, alumina, silicon or carbon. The conductive particles may be metal colloid particles and a metal filler. The binder resin may be an epoxy resin. The conductive base material is obtained by calcinating the laminate at 150-300°C. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP5632176(B2) 申请公布日期 2014.11.26
申请号 JP20100073086 申请日期 2010.03.26
申请人 发明人
分类号 H01B1/22;B32B27/00;B32B27/18;B32B27/36;C09D163/00 主分类号 H01B1/22
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