| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which forms a solder resist, which has sufficiently high heat resistance and thermal shock resistance, and a dry film showing sufficiently excellent storage stability, and is subjected to weak alkaline development; and to provide a photosensitive film for a permanent resist, a method for forming a resist pattern, a printed wiring board, a method for manufacturing the same, a surface-protective film and an interlayer insulating film, all of which use the photosensitive resin composition. <P>SOLUTION: The alkaline developable photosensitive resin composition contains: (A) a polymer having amine structure on its side chain or terminal; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) an Allyl compound; and (E) a maleimide compound. The photosensitive film for a permanent resist, the method for forming a resist pattern, the printed wiring board, the method for manufacturing the same, the surface-protective film and the interlayer insulating film all use the photosensitive resin composition. <P>COPYRIGHT: (C)2011,JPO&INPIT |
