发明名称 シリコーン変性エポキシ樹脂組成物、該樹脂組成物を含む光半導体封止組成物及び光半導体素子接着剤
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition which can give a cured product good in heat resistance, UV resistance, and storage stability. <P>SOLUTION: There is provided an epoxy resin composition containing a silicone-modified epoxy resin having the structure of general formula (1) [wherein R<SP POS="POST">1</SP>and R<SP POS="POST">2</SP>are each a specified organic group; and Y is an organic group containing a cyclic ether group]. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5629643(B2) 申请公布日期 2014.11.26
申请号 JP20110114123 申请日期 2011.05.20
申请人 发明人
分类号 C08G59/20;C08G59/42;H01L21/52;H01L23/29;H01L23/31;H01L33/56 主分类号 C08G59/20
代理机构 代理人
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