发明名称 光送信モジュール
摘要 PROBLEM TO BE SOLVED: To provide an optical transmitter module capable of transmitting an RF signal of 40 Gb/s from an FPC substrate to the inside of a TO-CAN package with low transmission loss and low reflection loss. SOLUTION: The optical transmitter module includes a TO-CAN package 13 and an FPC substrate 12. A coaxial pin 22 is so connected to a high frequency signal line on the surface of the FPC substrate that the interval between the coaxial pin 22 of the TO-CAN package and the FPC substrate becomes 0 or more and 0.1 mm or less. A DC pin of the TO-CAN package is bent and connected to a DC signal line on the rear side of the FPC substrate. The coaxial pin is connected to a high frequency signal line of a high-frequency circuit board 32 inside the TO-CAN package. The high frequency signal line, a resistor 35 inside the TO-CAN package, and an optical semiconductor element (DML 31) inside the TO-CAN package are electrically connected. A high frequency electric signal is made to be conductive to the optical semiconductor element from the high frequency signal line of the FPC substrate by way of the coaxial pin, the high frequency signal line of the high-frequency circuit board, and a resistance value of the resistor is 40Ωor more and 45Ωor less. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5631774(B2) 申请公布日期 2014.11.26
申请号 JP20110036139 申请日期 2011.02.22
申请人 发明人
分类号 H01S5/022 主分类号 H01S5/022
代理机构 代理人
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