| 摘要 |
A heat pump apparatus (100) according to the present invention includes a compressor (1) for compressing a low-temperature refrigerant and discharging a high-temperature refrigerant, a heat exchanger (2) through which water to be subjected to heat exchange with the high-temperature refrigerant flows, and an inverter module (3) that is mounted on the heat exchanger (2) and has a wide-bandgap semiconductor device in an inverter for converting a DC current to an AC current and supplies the AC current to the compressor. |
