发明名称 FLUX FOR FLUX-CORED SOLDER, AND FLUX-CORED SOLDER
摘要 To provide flux for flux cored solder that allows flux residue to have flexibility and can be used without depending on any soldering method. The flux for flux cored solder contains rosin, high molecular compound that prevents melt viscosity of the flux from being increased and allows a flux residue to have flexibility after heating by soldering, and halide that prevents the melt viscosity of the flux from being increased and by a combination of the high molecular compound that allows the flux residue to have flexibility after the heating by the soldering, allows the flux to cover a surface of solder melted during the heating by the soldering.
申请公布号 EP2805792(A1) 申请公布日期 2014.11.26
申请号 EP20130738641 申请日期 2013.01.08
申请人 SENJU METAL INDUSTRY CO., LTD. 发明人 SUGIURA, TAKAO;HIGASHIMURA, YOKO;ONITSUKA, MOTOHIRO;KAWANAGO, HIROSHI;TSURUTA, KAICHI
分类号 B23K35/363;B23K35/14;B23K35/22;H05K3/34 主分类号 B23K35/363
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