| 摘要 |
PROBLEM TO BE SOLVED: To relax a thermal stress acting on a base according to on/off of a thin film heater.SOLUTION: An insulating film 7, which is equipped with a hole 11 in the center and has a thin film heater, is disposed in a cavity 8 of a semiconductor substrate. The thin film heater is disposed between one end of the insulating film 7 and an end on the opposite side viewed from the hole 11 so as to surround and fold back the hole 11. All parts of the thin film heater are mutually connected in series. In one of the hole, the interconnection 12 of the thin film heater is one fewer than the other, and in one of the hole, one of dummy interconnections 16 and 17 which are made of the same material as the thin film heater and through which no heater current flows is provided. |
