| 摘要 |
<p>A method of fabricating a light emitting device (LED) includes measuring emission characteristics for a plurality of LED chips (10) configured to emit light of a first color (37). The plurality of LED chips (10) are sorted based on the measured emission characteristics to provide a plurality of groups (45A to 45D) respectively including ones of the plurality of LED chips (10) having similar measured emission characteristics. A respective light conversion material is selected for each of the plurality of groups (45A to 45D) based on the measured emission characteristics of the ones of the plurality of LED chips (10) included therein and a desired color point. The selected light conversion material is configured to absorb at least some of the light of the first color and responsively emit light of a second color. For each of the plurality of groups (45A to 45D), the respective selected light conversion material is deposited on the ones of the LED chips (10) included therein to provide a plurality of packaged LEDs including the plurality of LED chips (10) and respectively configured to emit light having the desired color point. Related apparatus (200) is also discussed.
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