发明名称 発光ダイオードチップ及びその製造方法
摘要 A light emitting diode includes a light emitting structure, a transparent conductive layer and a transparent protecting layer formed in sequence. A plurality of holes are defined in the transparent protecting layer to expose the transparent conductive layer out of the transparent protecting layer. A plurality of micro-structures are formed on a top surface of the transparent conductive layer in the holes. The micro-structures refract light emitted from the light emitting structure and travelling through the transparent conductive layer.
申请公布号 JP5632034(B2) 申请公布日期 2014.11.26
申请号 JP20130068229 申请日期 2013.03.28
申请人 发明人
分类号 H01L33/38 主分类号 H01L33/38
代理机构 代理人
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