发明名称 半導体装置の作製方法
摘要 <p>An object is to provide a method for manufacturing a highly reliable semiconductor device which includes a thin film transistor using an oxide semiconductor and having stable electric characteristics. In manufacture of a semiconductor device in which an oxide semiconductor is used for a channel formation region, after an oxide semiconductor film is formed, a conductive film including a metal, a metal compound, or an alloy that can absorb or adsorb moisture, a hydroxy group, or hydrogen is formed to overlap with the oxide semiconductor film with an insulating film provided therebetween. Then, heat treatment is performed in the state where the conductive film is exposed; in such a manner, activation treatment for removing moisture, oxygen, hydrogen, or the like adsorbed onto a surface of or in the conductive film is performed.</p>
申请公布号 JP5631676(B2) 申请公布日期 2014.11.26
申请号 JP20100210343 申请日期 2010.09.21
申请人 发明人
分类号 H01L21/336;G02F1/1368;G09F9/30;H01L21/28;H01L29/786;H01L51/50;H05B33/08 主分类号 H01L21/336
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