| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin which can be processed into a flexible metal clad laminate excellent in high-temperature processability, having preferable adhesion between a polyimide layer and a metal layer and also having preferable adhesion between a polyimide layer and a resist. SOLUTION: A polyamic acid is provided by polymerizing (A) at least one kind of biphenyl tetracarboxylic acid dianhydride selected from among 3, 4, 3', 4'-biphenyl tetracarboxylic dianhydride, 2, 3, 3', 4'-biphenyl tetracarboxylic acid dianhydride and 2, 3, 2', 3'-biphenyl tetracarboxylic acid dianhydride, (B) at least one kind of straight-chain acid dianhydride selected from among pyromellitic acid dianhydride, 2, 3, 6, 7-naphthalenetetracarboxylic acid dianhydride and 1, 4, 5, 8-naphthalenetetracarboxylic acid dianhydride, (C) 2, 2'-dimethyl-4, 4'-diaminobiphenyl and/or p-phenylene diamine and (D) at least one kind of diamine component selected from 1, 3-bis(3-aminophenoxy)benzene, 1, 3-bis(4-aminophenoxy) benzene, 3, 3'-diaminodiphenylether and 3, 4'-diaminodiphenylether. COPYRIGHT: (C)2013,JPO&INPIT |
