| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which meets a demand for improving the reliability. SOLUTION: A manufacturing method of a wiring board 4 according to one embodiment includes the steps of: placing a resin substrate 15 on a heat radiation member 16 through fluororubber 17; and forming a metal layer 12 on exposed one main surface of the resin substrate 15 placed on the heat radiation member 16 through the fluororubber 17 by using an evaporation method. Further, the manufacturing method of the wiring board 4 according to another embodiment includes the steps of: placing a resin substrate 15, having a first metal layer 12a on one main surface, on the heat radiation member 16 through the fluororubber 17 while disposing the fluororubber 17 on the first metal layer 12a side of the resin substrate 15; and forming a second metal layer 12b on the exposed other main surface of the resin substrate 15 placed on the heat radiation member 16 through the fluororubber 17 by using the evaporation method. COPYRIGHT: (C)2013,JPO&INPIT |
