发明名称 電子部品
摘要 PROBLEM TO BE SOLVED: To provide an electronic component which does not impede the radiation of heat generated by a semiconductor element for an amplifier, maintains a compact size, and has excellent electrical characteristics even though multiple built in circuit blocks are included therein. SOLUTION: A conductor pattern comprising a circuit block is placed in a region divided into a ground electrode formed in a laminate and a shield. A semiconductor element for an amplifier is mounted on a packaging electrode 11 formed in a portion on an upper surface of the laminate where the circuit block and a part of the shield are overlapped, and the shield is used as a heat radiation path of the semiconductor element for the amplifier. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5630697(B2) 申请公布日期 2014.11.26
申请号 JP20100233189 申请日期 2010.10.18
申请人 发明人
分类号 H01L23/12;H01L25/00 主分类号 H01L23/12
代理机构 代理人
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