发明名称 複合めっき処理方法および処理装置
摘要 PROBLEM TO BE SOLVED: To provide a method and device for processing composite plating capable of applying uniform and appropriate ultrasonic vibration to a plating object, and improving dispersibility of particles in a plating bath by the ultrasonic vibration to allow uniform large-area composite plating. SOLUTION: Ultrasonic vibration of two or more vibration modes are allowed to be excited on a plating object; curved traveling waves and a plurality of temporally-changing standing waves are excited on the plating object by the combination of the vibration modes to improve dispersibility of particles in a plating bath; and thereby a uniform composite plating coating can be formed. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5629851(B2) 申请公布日期 2014.11.26
申请号 JP20100224136 申请日期 2010.10.01
申请人 发明人
分类号 C25D15/02;C25D17/00;C25D17/08;C25D21/10 主分类号 C25D15/02
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