| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which a heat radiation member and a metallic layer are embedded and which suppresses generation of cracks on an insulation substrate when heated. SOLUTION: A wiring board of the present invention includes: an insulation substrate 1; a heat radiation member 2 installed within the insulation substrate 1 and having a recess 2a at a lower end thereof; and a metallic layer 3 installed within the insulation substrate 1, partially installed within the recess 2a and having a flat lower face. Due to this configuration, since the metallic layer 3 is not bent at a boundary between a portion where the metallic layer 3 is deformed along the recess 2a of the heat radiation member 2 and a portion where the metallic layer 3 is not deformed on the outside of the heat radiation member 2 in plan view, concentration of stress on the outside of the heat radiation member 2 in plane view is suppressed, and thereby suppressing generation of cracks on the insulation substrate between the lower face and the metallic layer 3 of the wiring board. COPYRIGHT: (C)2013,JPO&INPIT |
