发明名称 |
SEMICONDUCTOR PACKAGE HAVING HEAT SPREADER AND METHOD OF FORMING THE SAME |
摘要 |
<p>A lower package having semiconductor chips is arranged. First and second upper packages are formed on the lower package. A heat radiating plate is formed on the lower package and has an upper plate and an extension part connected to the upper plate. At least a portion of the first and second upper packages overlaps with the top of the semiconductor chips in a vertical direction. The upper plate is arranged on the first and second upper packages. The extension part is arranged between the first and second upper packages. The extension part has a higher vertical height than the horizontal width thereof.</p> |
申请公布号 |
KR20140135509(A) |
申请公布日期 |
2014.11.26 |
申请号 |
KR20130055876 |
申请日期 |
2013.05.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, HYUN KI |
分类号 |
H01L23/36;H01L23/12 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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