发明名称 SEMICONDUCTOR PACKAGE HAVING HEAT SPREADER AND METHOD OF FORMING THE SAME
摘要 <p>A lower package having semiconductor chips is arranged. First and second upper packages are formed on the lower package. A heat radiating plate is formed on the lower package and has an upper plate and an extension part connected to the upper plate. At least a portion of the first and second upper packages overlaps with the top of the semiconductor chips in a vertical direction. The upper plate is arranged on the first and second upper packages. The extension part is arranged between the first and second upper packages. The extension part has a higher vertical height than the horizontal width thereof.</p>
申请公布号 KR20140135509(A) 申请公布日期 2014.11.26
申请号 KR20130055876 申请日期 2013.05.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, HYUN KI
分类号 H01L23/36;H01L23/12 主分类号 H01L23/36
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