LIGHT EMITTING DIODE PACKAGE FRAME

摘要

The present invention relates to a light emitting diode package frame. Disclosed is the light emitting diode package frame which includes: a plurality of lead frames which are formed long, are adjacently arranged in a longitudinal direction, and includes a heat radiation plate which is bent with a stack shape to be integrated in any one frame; an out package which receives a part of the lead frames therein, includes an exposure part to partially expose the lead frames upward, and is formed to expose the heat radiation plate downward; and a fixing package which is integrated with the out package, is arranged on the lead frame in the exposure part, and supports an additional light emitting diode.