| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device chip assembly suppressing occurrence of color shift, and improving mass productivity. <P>SOLUTION: The light-emitting device chip assembly has: a light-emitting device chip provided with a light take-out portion and a bonding pad arranged adjacently to the light take-out portion on its upper surface; and a wavelength conversion sheet mold having a fluorescent material capable converting the wavelength of light emitted from the light-emitting device chip and stacked on the light-emitting device chip. The wavelength conversion sheet mold is sized within an upper surface of the light-emitting device chip, and covers the light take-out portion, a boundary between the light take-out portion and the bonding pad, and a part of the bonding pad on the boundary side. <P>COPYRIGHT: (C)2011,JPO&INPIT |
