| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure of an electronic component mounting substrate which exhibits excellent heat dissipation. SOLUTION: An electronic component mounting substrate 10 in which an electronic component 16 is held fixedly between metal circuit boards 24 and 28 of metal-ceramic circuit boards 12 and 14 where the metal circuit boards 24 and 28 are bonded to one surface of ceramic substrates 22 and 26 is held by means of a pair of coolers 44 and cooled. In such a cooling structure, the metal circuit boards 24 and 28 are bonded directly to one surfaces of the ceramic substrates 22 and 26. One cooler 44 is bonded directly to the other surface of the ceramic substrate 22 of the metal-ceramic circuit board 12 out of the two metal-ceramic circuit boards 12 and 14. COPYRIGHT: (C)2012,JPO&INPIT |
