DC voltage conversion module, semiconductor module, and method of making semiconductor module

摘要

A DC voltage conversion module includes a substrate, an input terminal, an output terminal, a ground terminal, a DC voltage conversion control element mounted on the substrate, a coil mounted on the substrate and connected to the DC voltage conversion control element and the output terminal, an input-side capacitor mounted on the substrate and connected to the input terminal and the ground terminal, and an output-side capacitor mounted on the substrate and connected to the output terminal and the ground terminal. The input terminal, the output terminal and the ground terminal project in a predetermined projecting direction parallel to each other. The ground terminal is arranged between the input terminal and the output terminal in a direction perpendicular to the projecting direction.

主权项

1. A DC voltage conversion module comprising:
a substrate including an obverse surface and a reverse surface; an input terminal, an output terminal, a ground terminal; a DC voltage conversion control element mounted on the obverse surface of the substrate; a coil mounted on the obverse surface of the substrate and connected to the DC voltage conversion control element and the output terminal; an input-side capacitor mounted on the substrate and connected to the input terminal and the ground terminal; and an output-side capacitor mounted on the substrate and connected to the output terminal and the ground terminal, wherein: the input terminal, the output terminal, and the ground terminal project in a predetermined projecting direction on and along a same single plane, the input terminal, the output terminal, and the ground terminal being positioned parallel to each other, the ground terminal is arranged between the input terminal and the output terminal in a direction perpendicular to the projecting direction, the substrate is formed with an obverse wiring pattern formed on the obverse surface, a reverse wiring pattern formed on the reverse surface, at least one through-hole penetrating the substrate and overlapping the obverse and the reverse wiring patterns as viewed in a thickness direction of the substrate, and a solder portion filling the through-hole, the input-side and the output-side capacitors are mounted on the obverse surface of the substrate, and the reverse wiring pattern includes a first block connected to the ground terminal and including a projecting portion projecting in the projecting direction to an opposite side of the input, the output and the ground terminals, and a second block having a U-shape surrounding the projecting portion.