Release strategies for making transferable semiconductor structures, devices and device components

摘要

Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.

主权项

1. A method for making a device or device component, said method comprising the steps of:
providing a sacrificial layer on at least a portion of a substrate surface, said sacrificial layer having a receiving surface; patterning said sacrificial layer to generate a pattern of exposed substrate surface; depositing a functional layer on at least a portion of said sacrificial layer receiving surface and exposed substrate surface pattern, thereby generating a plurality of functional layer anchors corresponding to said pattern of exposed substrate; releasing at least a portion of said functional layer, wherein the plurality of functional layer anchors remain at least partially anchored to said substrate and at least a portion of said functional layer not anchored to said substrate is released, thereby generating a plurality of transferable structures; and printing said plurality of transferable structures onto a device substrate or device component supported by a device substrate;wherein said functional layer is part of a multilayer structure, and the multilayer structure comprises a plurality of functional layers and adjacent functional layers are separated by a sacrificial layer.