发明名称 |
Methods of forming a high efficiency solar cell with a localized back surface field |
摘要 |
A solar cell, comprising: a doped silicon substrate, the silicon substrate comprising a front surface and a rear surface; a front phosphorous diffusion layer formed on the front surface; a front anti-reflective layer formed on the front phosphorous diffusion layer; a front metal electrode on the front surface in ohmic contact with the front phosphorous diffusion layer through the front anti-reflective layer; a rear passivation layer formed on the rear surface; a rear metal electrode in a pattern on the rear surface passing through the rear passivation layer; and a rear p+ diffusion area on the rear surface between the rear passivation layer and a boron-doped region of the silicon substrate, the rear p+ diffusion area surrounding the rear metal electrode. |
申请公布号 |
US8895348(B2) |
申请公布日期 |
2014.11.25 |
申请号 |
US201213687126 |
申请日期 |
2012.11.28 |
申请人 |
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发明人 |
Bendimerad Karim Lofti;Inns Daniel Aneurin;Poplavskyy Dmitry |
分类号 |
H01L21/00;H01L31/0216;H01L31/18;H01L31/068 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a high efficiency solar cell, comprising steps of:
(a) providing a doped silicon substrate, the substrate comprising a front surface and a rear surface; (b) depositing an ink on the rear surface in a pattern, the ink comprising a p-type dopant and a solvent; (c) heating the silicon substrate in a baking ambient to a first temperature and for a first time period in order to remove residual solvent from the deposited ink; (d) heating the silicon substrate in a diffusion ambient to a second temperature and for a second time period in order to diffuse the p-type dopant into the rear surface to form a rear p+ diffusion area on the rear surface; (e) exposing the silicon substrate to a phosphorous deposition ambient at a third temperature for a third time period, wherein a front PSG layer and a front phosphorous diffusion layer are formed on the front surface, and wherein a rear PSG layer and a rear phosphorous diffusion layer are formed on the rear surface; (f) exposing the silicon substrate to an etchant for a third time period, wherein the front PSG layer is removed, and wherein the rear PSG layer is removed; (g) depositing a front anti-reflective layer on the front surface and a rear passivation layer on the rear surface; and (h) forming a front metal electrode on the front surface in ohmic contact with the front phosphorous diffusion layer through the front anti-reflective layer and a rear metal electrode on the rear surface through the rear passivation layer, the rear metal electrode being formed on the rear p+ diffusion area on the rear surface. |
地址 |
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