发明名称 Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint
摘要 An electrical connector includes an insulative housing with a number of through holes extending therethrough, a number of contacts assembled to the insulative housing, and a number of solder balls disposed in the though holes and each is clasped by the tail and insulative housing. Each contact includes a vertical base portion secured to a first side of the through hole, a contact engaging arm extending from a top end of the base portion, and a solder portion extending from a bottom end of the base portion. The solder portion has a wave arrangement below the base portion and projecting from the base portion to a second side of the through hole which opposites to said first side, and a tail extending downwardly from the wave arrangement and capable of moving from the first side to the second side.
申请公布号 US8894422(B2) 申请公布日期 2014.11.25
申请号 US201113271242 申请日期 2011.10.12
申请人 Hon Hai Precision Industry Co., Ltd. 发明人 Yeh Cheng-Chi;Lin Nan-Hung;Cheng Andrew;Cheng Chih-Pi;Hsu Shuo-Hsiu;Hung Ting-Yao
分类号 H01R12/00;H01R12/57;H01R4/02;H05K3/34;H05K7/10;H01R12/71;H01R13/24;H01R43/02 主分类号 H01R12/00
代理机构 代理人 Chung Wei Te;Chang Ming Chieh
主权项 1. An electrical connector for connecting an electronic package and a printed circuit board, comprising: an insulative housing defining a plurality of passageways extending therethrough in a vertical direction between opposite upper and lower surfaces thereof; a plurality of contacts disposed in the corresponding passageways, respectively, each of the contacts defining a base portion retaining to the housing, an upper contacting section extending upwardly from the base portion and beyond the upper surface for contacting the electronic package, a tail section, with a waveform thereof, extending downwardly from the base portion to hold a solder ball for connecting to the printed circuit board; wherein in a side view, around a bottom portion of each passageway and for each solder ball, the housing provides a vertical wall and a downward oblique wall above said vertical wall to contact one lateral side of the corresponding solder ball at two respective points, and the waveform compliantly abuts against another lateral side of the corresponding solder ball.
地址 New Taipei TW