Composition and method to remove excess material during manufacturing of semiconductor devices

摘要

A composition of matter and method to remove excess material during the manufacturing of semiconductor devices includes providing a substrate; applying a metal chelator mixture to the substrate, where the metal chelator mixture comprising a metal chelator and a solvent, where the metal chelator binds to the platinum residue, to render the platinum residue soluble; and rinsing the metal chelator mixture from the substrate to remove the platinum residue from the silicide.

主权项

1. A method for removing platinum residues during semiconductor processing and manufacturing, said method comprising:
providing a substrate; applying a metal chelator mixture to said substrate,
said metal chelator mixture comprising a metal chelator and a solvent,wherein the metal chelator comprises a carboxylic acid group,wherein said metal chelator selectively binds to said platinum residues thereby rendering said platinum residues bound to the metal chelator soluble in the metal chelator mixture; and rinsing said metal chelator mixture to selectively remove said platinum residues from said substrate.