| 摘要 |
<p>The present invention relates to a front end module. The front end module according to the present invention includes a die pad on which a first amplifier and a second amplifier are mounted and a lead frame which includes a plurality of leads electrically connected to the die pad. The first amplifier receives driving power through at least one lead among the leads. The second amplifier receives the driving power from the first amplifier through wire bonding.</p> |
