发明名称 |
Solid electrolytic capacitor |
摘要 |
A solid electrolytic capacitor includes a capacitor element including a cathode portion and an anode portion, a cathode terminal bonded to the cathode portion, an anode terminal bonded to the anode portion, and an enclosure resin covering the capacitor element. The cathode terminal includes a cathode lower surface portion, a cathode connection portion, and a cathode support portion. The cathode connection portion is connected to an end portion of the cathode lower surface portion on an anode side and bonded to the cathode portion through a conductive adhesive. The cathode support portion is connected to a side portion of the cathode lower surface and brought into contact with a lower surface of the cathode portion on an end portion side of the cathode portion without involving the conductive adhesive therebetween. |
申请公布号 |
US8896984(B2) |
申请公布日期 |
2014.11.25 |
申请号 |
US201313762438 |
申请日期 |
2013.02.08 |
申请人 |
Panasonic Corporation |
发明人 |
Kawahito Kazuo;Iwakiri Takashi |
分类号 |
H01G9/15;H01G9/028;H01G9/10;H01G9/08;H01G9/00;H01G9/012 |
主分类号 |
H01G9/15 |
代理机构 |
Panasonic Patent Center |
代理人 |
Panasonic Patent Center |
主权项 |
1. A solid electrolytic capacitor comprising:
a capacitor element including a cathode portion and an anode portion; a cathode terminal bonded to the cathode portion; an anode terminal bonded to the anode portion; and an enclosure resin for covering the capacitor element, wherein the cathode terminal comprises:
a cathode lower surface portion exposed from a mounting surface of the enclosure resin and including an upper surface on which the enclosure resin is present:a cathode connection portion connected to an end portion of the cathode lower surface portion on an anode side and bonded to the cathode portion through a conductive adhesive; anda cathode support portion connected to a side portion of the cathode lower surface and brought into contact with a lower surface of the cathode portion on an end portion side of the cathode portion without involving the conductive adhesive therebetween. |
地址 |
Osaka JP |